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Through Silicon Vias (Materials, Models, Design, and Performance)
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Product Details
Author:
Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam
Format:
Paperback
Pages:
232
Publisher:
CRC Press (June 30, 2020)
Language:
English
ISBN-13:
9780367574543
Weight:
16oz
Dimensions:
6.125" x 9.1875"
File:
TAYLORFRANCIS-TayFran_260513043821732-20260513.xml
Folder:
TAYLORFRANCIS
List Price:
$68.99
As low as:
$65.54
Publisher Identifier:
P-CRC
Discount Code:
H
Country of Origin:
United States
Pub Discount:
30
Case Pack:
1
Imprint:
CRC Press
Overview
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
