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Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition

List Price: $173.00
SKU:
9780071821018
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  • Product Details

    Author:
    Peter Van Zant
    Format:
    Hardcover
    Pages:
    576
    Publisher:
    McGraw Hill LLC (January 7, 2014)
    Imprint:
    McGraw Hill
    Audience:
    General/trade
    ISBN-13:
    9780071821018
    ISBN-10:
    0071821015
    Weight:
    40oz
    Dimensions:
    7.7" x 9.5" x 1.44"
    File:
    McGrawHill-MH_ONIX_V30_US_onix30_all(26_07_28)-20260919-a.xml
    Folder:
    McGrawHill
    List Price:
    $173.00
    Pub Discount:
    33.4
    Case Pack:
    12
    As low as:
    $164.35
    Publisher Identifier:
    P-MCGRAW
    Discount Code:
    H
  • Overview

    Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  authenticity, or access to any online entitlements included with the product.



    The most complete, current guide to semiconductor processing

    Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.

    State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.

    COVERAGE INCLUDES:

    • The semiconductor industry
    • Properties of semiconductor materials and chemicals
    • Crystal growth and silicon wafer preparation
    • Wafer fabrication and packaging
    • Contamination control
    • Productivity and process yields
    • Oxidation
    • The ten-step patterning process--surface preparation to exposure; developing to final inspection
    • Next generation lithography
    • Doping
    • Layer deposition
    • Metallization
    • Process and device evaluation
    • The business of wafer fabrication
    • Devices and integrated circuit formation
    • Integrated circuits
    • Packaging