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Introduction to Microsystem Packaging Technology
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$89.99
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Product Details
Author:
Yufeng Jin, Zhiping Wang, Jing Chen
Format:
Paperback
Pages:
232
Publisher:
CRC Press (September 10, 2018)
Language:
English
ISBN-13:
9781138374256
Weight:
15.25oz
Dimensions:
7" x 10"
File:
TAYLORFRANCIS-TayFran_260331043202538-20260331.xml
Folder:
TAYLORFRANCIS
List Price:
$89.99
Country of Origin:
United States
Pub Discount:
30
Case Pack:
1
As low as:
$85.49
Publisher Identifier:
P-CRC
Discount Code:
H
Imprint:
CRC Press
Overview
Purposefully organized in independent chapters, the book systematically presents the widest possible overview of packaging knowledge. It illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It also details 3D-package and system-level package development with a decidedly MEMS perspective. Integrating the work of international engineers, this book presents a diversity of technologies in relation to MSP. Other topics in include encapsulation and sealing and system-in-package, device-level and optoelectronics packaging, and modular assembly, inspection, and reliability design. The book provides a number of real-world case studies.
