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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
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$79.99
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Product Details
Author:
Ephraim Suhir
Format:
Paperback
Pages:
406
Publisher:
CRC Press (October 4, 2024)
Language:
English
Audience:
Professional and scholarly
ISBN-13:
9780367635886
Dimensions:
6.125" x 9.1875"
File:
TAYLORFRANCIS-TayFran_260114060303725-20260114.xml
Folder:
TAYLORFRANCIS
List Price:
$79.99
Country of Origin:
United States
Pub Discount:
30
As low as:
$75.99
Publisher Identifier:
P-CRC
Discount Code:
H
Weight:
16oz
Case Pack:
1
Imprint:
CRC Press
Overview
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
