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Advanced Silicon & Semiconducting Silicon-Alloy Based Materials & Devices

List Price: $89.99
SKU:
9780367402174
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  • Product Details

    Author:
    Jo Nijs
    Format:
    Paperback
    Pages:
    466
    Publisher:
    CRC Press (September 11, 2019)
    Language:
    English
    ISBN-13:
    9780367402174
    Weight:
    16oz
    Dimensions:
    6.125" x 9.1875"
    File:
    TAYLORFRANCIS-TayFran_260124055354119-20260124.xml
    Folder:
    TAYLORFRANCIS
    List Price:
    $89.99
    Case Pack:
    1
    As low as:
    $85.49
    Publisher Identifier:
    P-CRC
    Discount Code:
    H
    Audience:
    General/trade
    Country of Origin:
    United States
    Pub Discount:
    30
    Imprint:
    CRC Press
  • Overview

    One of the first books to cover advanced silicon-based technologies, Advanced Silicon and Semiconducting Silicon Alloy-Based Materials and Devices presents important directions for research into silicon, its alloy-based semiconducting devices, and its development in commercial applications. The first section deals with single/mono crystalline silicon, focusing on the effects of heavy doping; the structure and electronic properties of defects and their impact on devices; the MBE of silicon, silicon alloys, and metals; CVD techniques for silicon and silicon germanium; the material properties of silicon germanium strained layers; silicon germanium heterojunction bipolar applications; FETs, IR detectors, and resonant tunneling devices in silicon, silicon germanium, and d-doped silicon; and the fascinating properties of crystalline silicon carbide and its applications. The second section explores polycrystalline silicon. It examines large grain polysilicon substrates for solar cells; the properties, analysis, and modeling of polysilicon TFTs; the technology of polysilicon TFTs in LCD displays; and the use of polycrystalline silicon and its alloys in VLSI applications. With contributors from leading academic and industrial research centers, this book provides wide coverage of fabrication techniques, material properties, and device applications.