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3D Integration in VLSI Circuits (Implementation Technologies and Applications)
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Product Details
Author:
Katsuyuki Sakuma
Format:
Paperback
Pages:
234
Publisher:
CRC Press (June 30, 2021)
Language:
English
ISBN-13:
9781032095547
Weight:
15.25oz
Dimensions:
6.125" x 9.1875"
File:
TAYLORFRANCIS-TayFran_260710050308415-20260710.xml
Folder:
TAYLORFRANCIS
List Price:
$84.99
Country of Origin:
United States
Series:
Devices, Circuits, and Systems
Case Pack:
10
As low as:
$80.74
Publisher Identifier:
P-CRC
Discount Code:
H
Pub Discount:
30
Imprint:
CRC Press
Overview
The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I
