- Home
- Technology & Engineering
- Electronics
- 3D IC Stacking Technology
3D IC Stacking Technology
List Price:
$173.00
- Availability: Confirm prior to ordering
- Branding: minimum 50 pieces (add’l costs below)
- Check Freight Rates (branded products only)
Branding Options (v), Availability & Lead Times
- 1-Color Imprint: $2.00 ea.
- Promo-Page Insert: $2.50 ea. (full-color printed, single-sided page)
- Belly-Band Wrap: $2.50 ea. (full-color printed)
- Set-Up Charge: $45 per decoration
- Availability: Product availability changes daily, so please confirm your quantity is available prior to placing an order.
- Branded Products: allow 10 business days from proof approval for production. Branding options may be limited or unavailable based on product design or cover artwork.
- Unbranded Products: allow 3-5 business days for shipping. All Unbranded items receive FREE ground shipping in the US. Inquire for international shipping.
- RETURNS/CANCELLATIONS: All orders, branded or unbranded, are NON-CANCELLABLE and NON-RETURNABLE once a purchase order has been received.
Product Details
Author:
Ajay Kumar, Sesh Ramaswami, Banqiu Wu
Format:
Hardcover
Pages:
544
Publisher:
McGraw Hill LLC (July 28, 2011)
Imprint:
McGraw Hill
Audience:
General/trade
ISBN-13:
9780071741958
ISBN-10:
007174195X
Weight:
27.52oz
Dimensions:
6.3" x 9.3" x 0.91"
File:
McGrawHill-MH_ONIX_V30_US_onix30_all(26_07_28)-20260919-a.xml
Folder:
McGrawHill
List Price:
$173.00
Pub Discount:
33.4
Case Pack:
22
As low as:
$164.35
Publisher Identifier:
P-MCGRAW
Discount Code:
H
Overview
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
The latest advances in three-dimensional integrated circuit stacking technology
With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.
3D IC Stacking Technology covers:
- High density through silicon stacking (TSS) technology
- Practical design ecosystem for heterogeneous 3D IC products
- Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
- Process integration for TSV manufacturing
- High-aspect-ratio silicon etch for TSV
- Dielectric deposition for TSV
- Barrier and seed deposition
- Copper electrodeposition for TSV
- Chemical mechanical polishing for TSV applications
- Temporary and permanent bonding
- Assembly and test aspects of TSV technology
